| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Density | 1.37 g/cc | 0.0495 lb/in³ | |||
| Filler Content | 40 % | 40 % | |||
| Water Absorption | 0.010 % | 0.010 % | 24 hrs., 50% RH | ||
| Linear Mold Shrinkage, Flow | 0.0010 - 0.0030 cm/cm | 0.0010 - 0.0030 in/in | |||
| Linear Mold Shrinkage, Transverse | 0.0020 - 0.0040 cm/cm | 0.0020 - 0.0040 in/in | |||
| Mechanical Properties | Metric | English | Comments | ||
| Tensile Strength at Break | 145 MPa | 21000 psi | |||
| Elongation at Break | 1.5 % | 1.5 % | |||
| Tensile Modulus | 13.7 GPa | 1990 ksi | |||
| Flexural Yield Strength | 220 MPa | 31900 psi | |||
| Flexural Modulus | 13.2 GPa | 1910 ksi | |||
| Izod Impact, Notched (ISO) | 11.0 kJ/m² | 5.23 ft-lb/in² | |||
| Izod Impact, Unnotched (ISO) | 40.0 kJ/m² | 19.0 ft-lb/in² | |||
| Charpy Impact Unnotched | 4.20 J/cm² | 20.0 ft-lb/in² | |||
| Charpy Impact, Notched | 1.20 J/cm² | 5.71 ft-lb/in² | |||
| Electrical Properties | Metric | English | Comments | ||
| Electrical Resistivity | 1.00e+16 ohm-cm | 1.00e+16 ohm-cm | |||
| Dielectric Constant | 3.1 | 3.1 | |||
| Dielectric Strength | 26.0 kV/mm | 660 kV/in | ASTM D145 | ||
| Dissipation Factor | 0.0010 | 0.0010 | IEC 60250 | ||
| Thermal Properties | Metric | English | Comments | ||
| CTE, linear, Parallel to Flow | 15.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
8.33 µin/in-°F @Temperature -22.0 - 86.0 °F |
|||
| CTE, linear, Transverse to Flow | 38.0 µm/m-°C | 21.1 µin/in-°F | |||
| Deflection Temperature at 0.46 MPa (66 psi) | 270 °C | 518 °F | |||
| Deflection Temperature at 1.8 MPa (264 psi) | 250 °C | 482 °F | |||
| Flammability, UL94 | HB @Thickness 0.750 mm |
HB @Thickness 0.0295 in |
|||
| Processing Properties | Metric | English | Comments | ||
| Melt Temperature | 280 - 310 °C | 536 - 590 °F | |||
| Mold Temperature | 50.0 - 80.0 °C | 122 - 176 °F | |||
| 130 - 155 °C | 266 - 311 °F | For optimal surface finish | |||
| De |
|||||
| Comments | low outgassing @ elevated temperatures | ||||
| No mold release | |||||
.

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