- 密度 [g/cm3]: 1.72
- 弯曲模量 [MPa]: 13.5
| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Density | 1.72 g/cc | 0.0621 lb/in³ | ISO 1183 | ||
| Apparent Bulk Density | 0.740 g/cc | 0.0267 lb/in³ | ISO 60 | ||
| Linear Mold Shrinkage, Flow | 0.0020 cm/cm | 0.0020 in/in | Injection molding; ISO 2577 | ||
| Mechanical Properties | Metric | English | Comments | ||
| Ball Indentation Hardness | 500 MPa | 72500 psi | H 961/30; ISO 2039/P1 | ||
| Flexural Strength | 140 MPa | 20300 psi | 2 mm/min; ISO 178 | ||
| Flexural Modulus | 13.5 GPa | 1960 ksi | ISO 178 | ||
| Compressive Strength | 250 MPa | 36300 psi | Test specimen flat tested; ISO 604 | ||
| Charpy Impact Unnotched | 1.00 J/cm² @Temperature 23.0 °C | 4.76 ft-lb/in² @Temperature 73.4 °F | ISO 179-1/2 eU | ||
| Charpy Impact, Notched | 0.200 J/cm² @Temperature 23.0 °C | 0.952 ft-lb/in² @Temperature 73.4 °F | ISO 179-1/2 eA | ||
| Electrical Properties | Metric | English | Comments | ||
| Volume Resistivity | 1.00e+12 ohm-cm | 1.00e+12 ohm-cm | IEC 60093 | ||
| Surface Resistance | 1.00e+11 ohm | 1.00e+11 ohm | IEC 60093 | ||
| Dielectric Constant | 7.0 @Frequency 100 Hz | 7.0 @Frequency 100 Hz | IEC 60250 | ||
| Dielectric Strength | 25.0 kV/mm @Thickness 1.00 mm | 635 kV/in @Thickness 0.0394 in | IEC 60243-P1 | ||
| Dissipation Factor | 0.060 @Frequency 100 Hz | 0.060 @Frequency 100 Hz | IEC 60250 | ||
| Arc Resistance | 125 - 130 sec | 125 - 130 sec | ASTM D495 | ||
| Comparative Tracking Index | 150 V | 150 V | Test liquid A; IEC 60112 | ||
| Thermal Properties | Metric | English | Comments | ||
| Maximum Service Temperature, Air | 175 °C | 347 °F | <20000 hours; IEC 60216-P1 | ||
| 220 °C | 428 °F | < 50 hours; IEC 60216-P1 | |||
| Deflection Temperature at 8.0 MPa | 190 °C | 374 °F | ISO 75-2 | ||
| Flammability, UL94 | V-0 @Thickness 1.50 mm | V-0 @Thickness 0.0591 in | (ALL) | ||
| Shrinkage | 0.00 % | 0.00 % | Injection molding, 168 hours/110°C; ISO 2577 | ||
| Processing Properties | Metric | English | Comments | ||
| Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding | ||
| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding | ||
| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding | ||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding | ||
| 160 - 190 °C | 320 - 374 °F | Compression molding | |||
| Injection Pressure | >= 15.0 MPa | >= 2180 psi | Compression and injection cavity mold pressure | ||
| Back Pressure | 0.500 - 2.00 MPa | 72.5 - 290 psi | Injection molding | ||
| Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Per 1 mm of wall thickness, injection molding | ||
| 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding | |||
| Descriptive Properties | |||||
| Chromatic Spectrum | All Colors | ||||
| Creep Rupture Strength | Very Good | ||||
| Holding Pressure | Approximately 40-60% of injection pressure | ||||
| Media Resistance | Very Good | ||||
| Moisture Absorption | 9 mg | ISO 62, 24 hours at 23°C | |||
| Reserves by Peak Temperature | Very High | ||||
| Thermal Expansion | Very Slight | ||||