- 熔体流动速率 [g/10min]: 36.0
- 吸水率 [%]: 0.1
- 缺口冲击强度: 0.43
- 弯曲模量 [MPa]: 3.90
| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Specific Gravity | 1.30 g/cc | 1.30 g/cc | ASTM D792 | ||
| Water Absorption | 0.10 % @Time 86400 sec | 0.10 % @Time 24.0 hour | ASTM D570 | ||
| Melt Flow | 36 g/10 min @Load 2.16 kg, Temperature 400 °C | 36 g/10 min @Load 4.76 lb, Temperature 752 °F | ASTM D1238 | ||
| Mechanical Properties | Metric | English | Comments | ||
| Tensile Strength | 100 MPa | 14500 psi | ASTM D638 | ||
| Elongation at Break | 10 - 20 % | 10 - 20 % | Crystallized; ASTM D638 | ||
| >= 60 % | >= 60 % | Quenched; ASTM D638 | |||
| Elongation at Yield | 5.2 % | 5.2 % | ASTM D638 | ||
| Tensile Modulus | 3.80 GPa | 551 ksi | ASTM D638 | ||
| Flexural Strength | 152 MPa | 22000 psi | ASTM D790 | ||
| Flexural Modulus | 3.90 GPa | 566 ksi | ASTM D790 | ||
| Izod Impact, Notched | 0.430 J/cm | 0.806 ft-lb/in | ASTM D256 | ||
| NB | NB | ASTM D256 | |||
| Thermal Properties | Metric | English | Comments | ||
| CTE, linear, Parallel to Flow | 50.0 µm/m-°C @Temperature -50.0 - 50.0 °C | 27.8 µin/in-°F @Temperature -58.0 - 122 °F | TMA; ASTM E831 | ||
| Melting Point | 343 °C | 649 °F | ASTM D3417 | ||
| Deflection Temperature at 1.8 MPa (264 psi) | 159 °C | 318 °F | Unannealed; ASTM D648 | ||
| Glass Transition Temp, Tg | 147 °C | 297 °F | ASTM D3417 | ||
| Descriptive Properties | |||||
| Appearance | Natural Color | ||||
| Availability | Africa & Middle East | ||||
| Asia Pacific | |||||
| Europe | |||||
| North America | |||||
| South America | |||||
| Features | Ductile | ||||
| Fatigue Resistant | |||||
| Flame Retardant | |||||
| Good Chemical Resistance | |||||
| Good Dimensional Stability | |||||
| Good Impact Resistance | |||||
| High Flow | |||||
| High Heat Resistance | |||||
| Forms | Powder | ||||
| Generic | PEEK | ||||
| Processing Method | Compression Molding | ||||
| Electrostatic Spray Coating | |||||
| RoHS Compliance | RoHS Compliant | ||||
| Uses | Electrical/Electronic Applications | ||||
| Industrial Applications | |||||
| Semiconductor Molding Compounds | |||||