- 弯曲强度 [MPa]: 30.3
- 弯曲模量 [MPa]: 10.3
| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Specific Gravity | 1.82 g/cc | 1.82 g/cc | ASTM D792 | ||
| Water Absorption | <= 0.060 % | <= 0.060 % | 24 hours, 23°C; ASTM D570 | ||
| Linear Mold Shrinkage | 0.0010 cm/cm | 0.0010 in/in | ASTM D955 | ||
| Mechanical Properties | Metric | English | Comments | ||
| Tensile Strength, Ultimate | >= 30.3 MPa | >= 4400 psi | ASTM D638 | ||
| Flexural Strength | >= 40.0 MPa | >= 5800 psi | ASTM D790 | ||
| Flexural Modulus | >= 10.3 GPa | >= 1500 ksi | ASTM D790 | ||
| Izod Impact, Unnotched | 0.160 J/cm | 0.300 ft-lb/in | |||
| Dynatup @ -18°C | 3.57 J | 2.63 ft-lb | |||
| Dynatup @ -18°C Max Load | 76600 g | 169 lb | |||
| Electrical Properties | Metric | English | Comments | ||
| Volume Resistivity | 0.010 ohm-cm | 0.010 ohm-cm | in plane | ||
| 0.020 ohm-cm | 0.020 ohm-cm | Through plane | |||
| Thermal Properties | Metric | English | Comments | ||
| CTE, linear | >= 30.0 µm/m-°C @Temperature 20.0 °C | >= 16.7 µin/in-°F @Temperature 68.0 °F | |||
| Specific Heat Capacity | 0.841 J/g-°C | 0.201 BTU/lb-°F | through-plane | ||
| Thermal Conductivity | 19.2 W/m-K | 133 BTU-in/hr-ft²-°F | Through Plane | ||
| 46.2 W/m-K | 321 BTU-in/hr-ft²-°F | In-Plane | |||
| 18.5 W/m-K @Temperature 85.0 °C | 128 BTU-in/hr-ft²-°F @Temperature 185 °F | Through Plane | |||
| 43.7 W/m-K @Temperature 85.0 °C | 303 BTU-in/hr-ft²-°F @Temperature 185 °F | In Plane | |||
| Glass Transition Temp, Tg | >= 200 °C | >= 392 °F | |||
| Flammability, UL94 | V-0 @Thickness 3.56 mm | V-0 @Thickness 0.140 in | |||
| Processing Properties | Metric | English | Comments | ||
| Mold Temperature | 163 - 168 °C | 325 - 335 °F | |||
| Cure Time | 0.500 - 1.00 min | 0.00833 - 0.0167 hour | |||
| Descriptive Properties | |||||
| Compressive Creep, 200 psi | 0.025% | 200hr @ 80°C | |||
| 0.04% | 1000hr @ 80°C | ||||
| Diffusivity, cm²/s | 0.098 | 85°C Through Plane | |||
| 0.125 | 25°C Through Plane | ||||
| 0.231 | 85° In-Plane | ||||
| 0.302 | 25° In-Plane | ||||
| DMA-Modulus | 0.5 | 10^6 psi, 200°C | |||
| 0.94 | 10^6 psi, 175°C | ||||
| 1.23 | 10^6 psi, 150°C | ||||
| 1.6 | 10^6 psi, 100°C | ||||
| 2 | 10^6 psi, 25°C | ||||