- 密度 [g/cm3]: 1.96
- 弯曲强度 [MPa]: 2.07
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.96 g/cc | 0.0708 lb/in³ | ASTM D1475 |
| Moisture Absorption at Equilibrium | 0.15 % | 0.15 % | Cured property; ASTM D570 |
| Outgassing - Total Mass Loss | 0.50 % | 0.50 % | Cured property; at 10E-6 torr; ASTM E595 |
| Collected Volatile Condensable Material | 0.040 % | 0.040 % | Cured property; at 10E-6 torr; ASTM E595 |
| Mechanical Properties | Metric | English | Comments |
| Tensile Strength, Ultimate | 2.07 MPa @Thickness 0.203 mm | 300 psi @Thickness 0.00800 in | Cured; ASTM D638 |
| Elongation at Break | 70 % @Thickness 0.203 mm | 70 % @Thickness 0.00800 in | Cured; ASTM D638 |
| Tensile Modulus | 0.00379 GPa @Thickness 0.127 mm | 0.550 ksi @Thickness 0.00500 in | Cured; ASTM D638 |
| Electrical Properties | Metric | English | Comments |
| Volume Resistivity | 7.00e+14 ohm-cm | 7.00e+14 ohm-cm | Cured property; ASTM D257 |
| Dielectric Constant | 5.8 @Frequency 1000 Hz | 5.8 @Frequency 1000 Hz | Cured property; ASTM D150 |
| Dielectric Strength | 39.4 kV/mm @Thickness 0.127 mm | 1000 kV/in @Thickness 0.00500 in | Cured; ASTM D149 |
| Dissipation Factor | 0.030 @Frequency 1000 Hz | 0.030 @Frequency 1000 Hz | Cured property; ASTM D150 |
| Thermal Properties | Metric | English | Comments |
| CTE, linear | 40.0 µm/m-°C @Temperature 20.0 °C | 22.2 µin/in-°F @Temperature 68.0 °F | Cured property; alpha 1 |
| 160 µm/m-°C @Temperature 20.0 °C | 88.9 µin/in-°F @Temperature 68.0 °F | Cured property; alpha 2 | |
| Thermal Conductivity | 0.800 W/m-K | 5.55 BTU-in/hr-ft²-°F | |
| Glass Transition Temp, Tg | -75.0 °C | -103 °F | Cured property; ASTM E831-86 |
| Processing Properties | Metric | English | Comments |
| Processing Temperature | 85.0 °C | 185 °F | Cure 4 hrs |
| 100 °C | 212 °F | Cure 2 hrs | |
| 125 °C | 257 °F | Cure 1 hrs | |