- 密度 [g/cm3]: 1.5
- 吸水率 [%]: 0.8
| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Density | 1.50 g/cc | 0.0542 lb/in³ | ASTM D792 Method A | ||
| Water Absorption | 0.80 % | 0.80 % | IPC TM-650 2.6.2.1 | ||
| Mechanical Properties | Metric | English | Comments | ||
| Modulus of Elasticity | 27.6 GPa | 4000 ksi | IPC TM-650 2.4.18.3 | ||
| Poissons Ratio | 0.20 | 0.20 | ASTM D3039 | ||
| Peel Strength | 1.05 kN/m | 6.00 pli | To Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8 | ||
| 1.05 kN/m | 6.00 pli | To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8 | |||
| 1.05 kN/m | 6.00 pli | To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2 | |||
| Electrical Properties | Metric | English | Comments | ||
| Volume Resistivity | 1.30e+13 ohm-cm | 1.30e+13 ohm-cm | C96/35/90; IPC TM-650 2.5.17.1 | ||
| Surface Resistance | 3.20e+13 ohm | 3.20e+13 ohm | C96/35/90; IPC TM-650 2.5.17.1 | ||
| Dielectric Constant | 3.9 @Frequency 1.00e+6 Hz | 3.9 @Frequency 1.00e+6 Hz | may vary with resin %; IPC TM-650 2.5.5.3 | ||
| Dielectric Strength | >= 29.5 kV/mm | >= 750 kV/in | IPC TM-650 2.5.6.2 | ||
| Dissipation Factor | 0.016 @Frequency 1.00e+6 Hz | 0.016 @Frequency 1.00e+6 Hz | IPC TM-650 2.5.5.3 | ||
| Thermal Properties | Metric | English | Comments | ||
| CTE, linear | 5.00 - 7.00 µm/m-°C | 2.78 - 3.89 µin/in-°F | IPC TM-650 2.4.41 | ||
| CTE, linear, Transverse to Flow | 75.0 µm/m-°C | 41.7 µin/in-°F | z, below Tg; IPC TM-650 2.4.24 | ||
| 225 µm/m-°C | 125 µin/in-°F | z, above Tg; IPC TM-650 2.4.24 | |||
| Thermal Conductivity | 0.220 W/m-K | 1.53 BTU-in/hr-ft²-°F | ASTM E1461 | ||
| Glass Transition Temp, Tg | 170 °C | 338 °F | DSC; IPC TM-650 2.4.25 | ||
| Flammability, UL94 | V-0 | V-0 | |||
| Descriptive Properties | |||||
| Z-Axis Expansion (%) | 2.8 | IPC TM-650 2.4.24 (50-260°C) | |||