| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Specific Gravity | 2.65 - 3.15 g/cc | 2.65 - 3.15 g/cc | ASTM D792 | ||
| Mechanical Properties | Metric | English | Comments | ||
| Hardness, Shore A | 33 - 47 | 33 - 47 | ASTM D2240 | ||
| Tensile Strength | >= 0.552 MPa | >= 80.0 psi | ASTM D412 | ||
| Elongation at Break | >= 75 % | >= 75 % | ASTM D412 | ||
| Compression Set | <= 30 % @Temperature 100 °C, Time 252000 sec | <= 30 % @Temperature 212 °F, Time 70.0 hour | ASTM D395, Method B | ||
| Electrical Properties | Metric | English | Comments | ||
| Volume Resistivity | <= 0.050 ohm-cm | <= 0.050 ohm-cm | without pressure-sensitive adhesive; CEPS-0002 | ||
| Shielding Effectiveness | >= 70 dB @Frequency 2.00e+9 Hz | >= 70 dB @Frequency 2.00e+9 Hz | Plane Wave; Method 3, CHO-TM-TP09 | ||
| >= 70 dB @Frequency 1.00e+10 Hz | >= 70 dB @Frequency 1.00e+10 Hz | Plane Wave; Method 3, CHO-TM-TP09 | |||
| >= 80 dB @Frequency 1.00e+8 Hz | >= 80 dB @Frequency 1.00e+8 Hz | E-Field; Method 3, CHO-TM-TP09 | |||
| >= 80 dB @Frequency 5.00e+8 Hz | >= 80 dB @Frequency 5.00e+8 Hz | E-Field; Method 3, CHO-TM-TP09 | |||
| Thermal Properties | Metric | English | Comments | ||
| Thermal Conductivity | 0.800 W/m-K @Pressure 2.07 MPa | 5.55 BTU-in/hr-ft²-°F @Pressure 300 psi | ASTM D5470 | ||
| Maximum Service Temperature, Air | 125 °C | 257 °F | |||
| Minimum Service Temperature, Air | -60.0 °C | -76.0 °F | Flex TR10 | ||
| Descriptive Properties | |||||
| Binder | Silicone | ||||
| Filler | Ag/Cu | ||||
| Heat Aging | <0.1 ohm-cm | 150°C for 48 hr, CEPS-0002 | |||
