- 密度 [g/cm3]: 1.75
- 弯曲模量 [MPa]: 11.0
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.75 g/cc | 0.0632 lb/in³ | ISO 1183 |
| Density of Compound | 1.48 g/cc | 0.0535 lb/in³ | melt; Internal |
| Linear Mold Shrinkage, Flow | 0.000900 cm/cm | 0.000900 in/in | ISO 294-4 |
| Linear Mold Shrinkage, Transverse | 0.00500 cm/cm | 0.00500 in/in | ISO 294-4 |
| Mechanical Properties | Metric | English | Comments |
| Tensile Strength at Break | 115 MPa | 16700 psi | 5mm/min; ISO 527-2/1A |
| Elongation at Break | 3.10 % | 3.10 % | 5mm/min; ISO 527-2/1A |
| Tensile Modulus | 15.0 GPa | 2180 ksi | 1mm/min; ISO 527-2/1A |
| Flexural Strength | 190 MPa | 27600 psi | ISO 178 |
| Flexural Modulus | 11.0 GPa | 1600 ksi | ISO 178 |
| Compressive Strength | 21.3 MPa | 3090 psi | 1% strain; ISO 604 |
| 71.0 MPa | 10300 psi | ISO 604 | |
| Electrical Properties | Metric | English | Comments |
| Volume Resistivity | 1.00e+15 ohm-cm | 1.00e+15 ohm-cm | IEC 60093 |
| Surface Resistance | 1.00e+15 ohm | 1.00e+15 ohm | IEC 60093 |
| Dielectric Constant | 3.90 @Frequency 1.00e+6 Hz | 3.90 @Frequency 1.00e+6 Hz | IEC 60250 |
| Dielectric Strength | 45.0 kV/mm | 1140 kV/in | IEC 60243-1 |
| Dissipation Factor | 0.0180 @Frequency 1.00e+6 Hz | 0.0180 @Frequency 1.00e+6 Hz | IEC 60250 |
| Comparative Tracking Index | 175 V | 175 V | IEC 60112 |
| Thermal Properties | Metric | English | Comments |
| CTE, linear | 7.00 µm/m-°C | 3.89 µin/in-°F | ISO 11359-2 |
| CTE, linear, Transverse to Flow | 60.0 µm/m-°C | 33.3 µin/in-°F | ISO 11359-2 |
| Specific Heat Capacity | 1.50 J/g-°C | 0.359 BTU/lb-°F | Internal |
| Thermal Conductivity | 0.350 W/m-K | 2.43 BTU-in/hr-ft²-°F | Internal |
| Melting Point | 319 °C | 606 °F | 10°C/min; ISO 11357-1,-2,-3 |
| Deflection Temperature at 1.8 MPa (264 psi) | 290 °C | 554 °F | ISO 75-1, -2 |
| Flammability, UL94 | V-0 @Thickness 1.60 mm | V-0 @Thickness 0.0630 in | UL94 |
| V-0 @Thickness 0.800 mm | V-0 @Thickness 0.0315 in | UL94 | |
| Oxygen Index | 33.0 % | 33.0 % | ISO 4589 |
| Processing Properties | Metric | English | Comments |
| Processing Temperature | 20.0 - 30.0 °C | 68.0 - 86.0 °F | |
| 80.0 - 120 °C | 176 - 248 °F | Cavity temperature | |
| 265 °C | 509 °F | Ejection temperature; Internal | |
| Feed Temperature | 40.0 - 60.0 °C | 104 - 140 °F | |
| Zone 1 | 320 - 330 °C | 608 - 626 °F | |
| Zone 2 | 335 - 345 °C | 635 - 653 °F | |
| Zone 3 | 335 - 345 °C | 635 - 653 °F | |
| Zone 4 | 335 - 345 °C | 635 - 653 °F | |
| Die Temperature | 335 - 345 °C | 635 - 653 °F | |
| Melt Temperature | 325 - 345 °C | 617 - 653 °F | |
| 325 - 345 °C | 617 - 653 °F | ||
| 335 °C | 635 °F | Optimum | |
| Mold Temperature | 80.0 °C | 176 °F | Optimum |
| 40.0 - 150 °C | 104 - 302 °F | ||
| Drying Temperature | 150 °C | 302 °F | |
| Dry Time | 3.00 hour | 3.00 hour | |
| Moisture Content | 0.0100 % | 0.0100 % | Necessary low maximum residual |
| Injection Pressure | 50.0 - 150 MPa | 7250 - 21800 psi | |
| Hold Pressure | 50.0 - 150 MPa | 7250 - 21800 psi | |
| Back Pressure | 3.00 MPa | 435 psi | |